Eugene J. Rymaszewski,Alan G. Klopfenstein,R. R. Tummala: Microelectronics Packaging Handbook: Technology Drivers Part I
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Author: Eugene J. Rymaszewski,Alan G. Klopfenstein,R. R. Tummala
Number of Pages: 720 pages
Published Date: 23 Oct 2012
Publisher: Springer-Verlag New York Inc.
Publication Country: New York, NY, United States
Language: English
ISBN: 9781461368298
Download Link: Click Here
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